For low-temperature packaging board will cause some damage, we all understand the principle of thermal expansion and contraction, so the packaging during transport board we all have to give a positive conservation, the damage to a minimum in order to maximize the value of the packaging board. Low temperature for packaging boards in the end what kind of impact will result, we first look at the product packaging boards constituted: Packaging board is glued to the slab veneer glue curing adhesive layer formed so definitely stick in temperature, pressure, The veneer glued together firmly. The temperature is an important factor in this process links. Extractor hot temperatures, provided an important basis for sizing and supply fast chemical reactions required for moisture evaporation layer of heat required. In order to shorten the pressing cycle, is generally higher than that required for curing to take the temperature of the gel layer. For thin packaging boards and the number of copies per cell lamination can take little higher temperature, but for multi-layer packaging board, or the number of copies per cell lamination much relief in order to prevent the process of presenting "bubble" is often taken to lower temperature. www. sdydwood. com together in a hot slab process, the temperature rise is hot single discipline only need 8 ~ 15s, the layer that reach temperatures above 100 ~ C, 45 ~ 60s can make the glue to cure. Winter low temperatures generally refers to the use of packaging board, where special attention is needed to prevent damage to the packaging board phenolic resin film surface, if prolonged storage should be maintained in the packaging board coated exterior agent.